One of the most challenging enclosure design projects is perhaps IP67 enclosure design for automotive electronics. These enclosures are subjected to unprecedented vibration, extreme temperature variations along with most unfavourable ingress and impact conditions.
The project team consisted mostly of mechanical engineers supported by industrial designers. As usual, project incubation included the study of existing products, learning the best practices in the industry and gearing up to set challenging goals for the project.
Visualisation CAD was done to evaluate potential concepts.
Key changes were made and the design was moving towards its final revision.
Validation of the design was done by building the Mark1 prototype.Graphics & UI design.
Further, engineering refinement on Mark1 prototypes resulted in Mark2 prototypes which are now ready for mass production. Prior to mass production, new prototypes of the IP67 Enclosure Design was built for testing and compliance.